JPH0720923Y2 - 電子部品 - Google Patents
電子部品Info
- Publication number
- JPH0720923Y2 JPH0720923Y2 JP1988025990U JP2599088U JPH0720923Y2 JP H0720923 Y2 JPH0720923 Y2 JP H0720923Y2 JP 1988025990 U JP1988025990 U JP 1988025990U JP 2599088 U JP2599088 U JP 2599088U JP H0720923 Y2 JPH0720923 Y2 JP H0720923Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- external
- bent
- circuit board
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 description 18
- 239000011347 resin Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 14
- 239000008393 encapsulating agent Substances 0.000 description 7
- 238000007789 sealing Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000009795 derivation Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988025990U JPH0720923Y2 (ja) | 1988-03-01 | 1988-03-01 | 電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988025990U JPH0720923Y2 (ja) | 1988-03-01 | 1988-03-01 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01130557U JPH01130557U (en]) | 1989-09-05 |
JPH0720923Y2 true JPH0720923Y2 (ja) | 1995-05-15 |
Family
ID=31247206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988025990U Expired - Lifetime JPH0720923Y2 (ja) | 1988-03-01 | 1988-03-01 | 電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0720923Y2 (en]) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006190972A (ja) * | 2004-12-08 | 2006-07-20 | Mitsubishi Electric Corp | 電力用半導体装置 |
JP2023068517A (ja) * | 2021-11-02 | 2023-05-17 | ニデックパワートレインシステムズ株式会社 | リード部材の回路基板へのはんだ接合構造 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5843232Y2 (ja) * | 1977-06-30 | 1983-09-30 | 松下電器産業株式会社 | トランジスタ取付装置 |
-
1988
- 1988-03-01 JP JP1988025990U patent/JPH0720923Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH01130557U (en]) | 1989-09-05 |
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